Sheet-type automatic cleaning device
Providing suitable custom equipment tailored to your needs! Design capable of process optimization.
This device is a single-wafer cleaning system compatible with SiC wafers of φ150mm (6") and φ200mm (8"). Wafers are loaded by the operator into a cassette containing 25 wafers on the LD side. After cleaning, the wafers are stored in a clean cassette set on the ULD side. The process is as follows: LD (underwater) → both-side brush scrubbing → both-side brush scrubbing → ultrasonic shower cleaning → spin drying → ULD (in air).
- Company：PHT
- Price：Other
